Light emitting device and method for manufacturing the same, and display device

ABSTRACT

The present disclosure provides a light emitting device and a method for manufacturing the same, and a display device, and relates to the technical field of display. The light emitting device includes: a pixel define layer; a plurality of sub-pixels, comprising a first sub-pixel and a second sub-pixel adjacent to and spaced apart from the first sub-pixel by the pixel define layer, wherein each of the plurality of sub-pixels comprises a functional layer; and a blocking member disposed on the pixel define layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a U.S. National Stage Application under 35U.S.C. § 371 of International Patent Application No. PCT/CN2018/113390,filed on Nov. 1, 2018, which claims priority to China Patent Application201820418243.0, filed on Mar. 27, 2018, the disclosures of each of whichare incorporated by reference herein in entirety.

TECHNICAL FIELD

The present disclosure relates to the technical field of display, andparticularly to a light emitting device and a method for manufacturingthe same, and a display device.

BACKGROUND

In an OLED (Organic Light Emitting Diode) device of the related art,when the materials of light emitting layers of sub-pixels with aplurality of colors are formed by a FMM (Fine Metal Mask) process,respectively, an organic layer corresponding to a color needs to bevapor-deposited in each sub-pixel. A boundary of a sub-pixel lightemitting area is defined by a Pixel Define Layer (PDL) to form asub-pixel well. An organic layer is filled in the sub-pixel well. Butlight each sub-pixel emits can still be transmitted within the materialof the PDL.

At present, the PPI (pixels per inch) of small-sized products is gettinghigher and higher, and the space between sub-pixels is getting smallerand smaller, but the brightness is required to be higher and higher. Inan OLED device, the light each sub-pixel emits is mainly in a directionperpendicular to a surface of the sub-pixel.

SUMMARY

According to one aspect of embodiments of the present disclosure, alight emitting device is provided. The light emitting device comprises:a pixel define layer; a plurality of sub-pixels, comprising a firstsub-pixel and a second sub-pixel adjacent to and spaced apart from thefirst sub-pixel by the pixel define layer, wherein each of the pluralityof the sub-pixels comprises a functional layer; and a blocking memberdisposed on the pixel define layer.

In some embodiments, the blocking member comprises a first component anda second component stacked on the pixel define layer, wherein a materialof the first component is the same as that of at least a part of thefunctional layer of the first sub-pixel, and a material of the secondcomponent is the same as that of at least a part of the functional layerof the second sub-pixel.

In some embodiments, the functional layer comprises a light emittinglayer.

In some embodiments, the functional layer further comprises a firstcarrier transport layer and a second carrier transport layertherebetween the light emitting layer being located; the first componentand the second component each comprises a part of a same material asthat of the first carrier transport layer, and the part of the samematerial as that of the first carrier transport layer of the firstcomponent is spaced apart from the part of the same material as that ofthe first carrier transport layer of the second component.

In some embodiments, the first component comprises three parts of a samematerial as that of the first carrier transport layer, the secondcarrier transport layer, and the light emitting layer of the firstsub-pixel, respectively; the second component comprises three parts of asame material as that of the first carrier transport layer, the secondcarrier transport layer, and the light emitting layer of the secondsub-pixel, respectively.

In some embodiments, the blocking member comprises an insulating layer.

In some embodiments, a slope angle θ formed by the blocking member onthe pixel define layer ranges from 1°<θ<60°.

In some embodiments, the first component is a part of the functionallayer of the first sub-pixel extending above the pixel define layer, andthe second component is a part of the functional layer of the secondsub-pixel extending above the pixel define layer.

In some embodiments, in a case where the second component covers thefirst component: the first sub-pixel is a red sub-pixel, and the secondsub-pixel is a green sub-pixel or a blue sub-pixel; or the firstsub-pixel is a green sub-pixel, and the second sub-pixel is a bluesub-pixel.

In some embodiments, in the plurality of sub-pixels: a sum of areas ofthe functional layer of the blue sub-pixel and the part of thefunctional layer of the blue sub-pixel extending above the pixel definelayer is greater than that of the functional layer of the red sub-pixeland the part of the functional layer of the red sub-pixel extendingabove the pixel define layer, and a sum of areas of the functional layerof the red sub-pixel and the part of the functional layer of the redsub-pixel extending above the pixel define layer is greater than that ofthe functional layer of the green sub-pixel and the part of thefunctional layer of the green sub-pixel extending above the pixel definelayer.

In some embodiments, in a case where the first sub-pixel is a redsub-pixel and the second sub-pixel is a green sub-pixel, the blockingmember has a thickness ranging from 500 Å to 3500 Å; in a case where thefirst sub-pixel is a green sub-pixel, and the second sub-pixel is a bluesub-pixel, the blocking member has a thickness ranging from 400 Å to2700 Å; or in a case where the first sub-pixel is a red sub-pixel, andthe second sub-pixel is a blue sub-pixel, the blocking member has athickness ranging from 400 Å to 2700 Å.

According to another aspect of embodiments of the present disclosure, alight emitting device is provided. The light emitting device comprises:a plurality of drive transistors, each of the plurality of drivetransistors comprising a first electrode; a substrate located on oneside of the plurality of drive transistors; a plurality of organic lightemitting diodes located on the other side of the plurality of drivetransistors opposite to the substrate, comprising at least a firstorganic light emitting diode and a second organic light emitting diodeadjacent to and spaced apart from the first organic light emitting diodeby a pixel define layer, wherein: each of the plurality of organic lightemitting diodes comprises a second electrode electrically connected tothe first electrode, a third electrode, and a functional layer at leasta part of which being located between the second electrode and the thirdelectrode, and the functional layer comprises at least a light emittinglayer, an area of a surface of the light emitting layer away from thesubstrate is greater than that of a surface of the second electrode awayfrom the substrate; and a blocking member located on a side of the pixeldefine layer away from the substrate, wherein a projection of theblocking member on the substrate is spaced apart from a projection ofthe second electrode on the substrate, and the blocking member comprisesa part of a same material as that of the functional layer.

In some embodiments, the first electrode is a source electrode; each ofthe plurality of drive transistors further comprises a gate electrode, adrain electrode, and a semiconductor layer, wherein a projection of thesemiconductor layer on the substrate is located within a projection ofthe second electrode on the substrate.

In some embodiments, the functional layer further comprises a holetransport layer and an electron transport layer, wherein an area of asurface of the hole transport layer away from the substrate and an areaof a surface of the electron transport layer away from the substrateeach is greater than that of a surface of the second electrode away fromthe substrate.

In some embodiments, a slope angle θ formed by the blocking member onthe pixel define layer ranges from 1°<θ<60°.

In some embodiments, the blocking member comprises a first component anda second component stacked on the pixel define layer, wherein a materialof the first component is the same as that of at least a part of thefunctional layer of the first organic light emitting diode, and amaterial of the second component is the same as that of at least a partof the functional layer of the second organic light emitting diode.

In some embodiments, the first component is a part of the functionallayer of the first organic light emitting diode extending above thepixel define layer, and the second component is a part of the functionallayer of the second organic light emitting diode extending above thepixel define layer.

In some embodiments, in a case where the second component covers thefirst component: the first organic light emitting diode is a red organiclight emitting diode, and the second organic light emitting diode is agreen organic light emitting diode or a blue organic light emittingdiode; or the first organic light emitting diode is a green organiclight emitting diode, and the second organic light emitting diode is ablue organic light emitting diode.

In some embodiments, in a case where the first organic light emittingdiode is a red organic light emitting diode and the second organic lightemitting diode is a green organic light emitting diode, the blockingmember has a thickness ranging from 500 Å to 3500 Å; in a case where thefirst organic light emitting diode is a green organic light emittingdiode, and the second organic light emitting diode is a blue organiclight emitting diode, the blocking member has a thickness ranging from400 Å to 2700 Å; or in a case where the first organic light emittingdiode is a red organic light emitting diode, and the second organiclight emitting diode is a blue organic light emitting diode, theblocking member has a thickness ranging from 400 Å to 2700 Å.

According to still another aspect of embodiments of the presentdisclosure, a display device is provided. The display device comprisesthe light emitting device according to any one of the above embodiments.

According to still another aspect of embodiments of the presentdisclosure, a method for manufacturing a light emitting device isprovided. The method comprises: forming a pixel define layer on aninitial substrate structure, wherein the pixel define layer is formedwith a plurality of openings exposing the initial substrate structure;and forming functional layers for a plurality of sub-pixels in theplurality of openings, and forming a blocking member on the pixel definelayer.

In some embodiments, in a case where a material of the blocking memberis the same as that of at least a part of the functional layers, theblocking member is formed during formation of the functional layers.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which constitute part of this specification,illustrate exemplary embodiments of the present disclosure and, togetherwith this specification, serve to explain the principles of the presentdisclosure.

The present disclosure can be understood more clearly from the followingdetailed description with reference to the accompanying drawings, inwhich:

FIG. 1 is a schematic sectional view schematically showing a lightemitting device according to an embodiment of the present disclosure;

FIG. 2 is a schematic sectional view schematically showing a lightemitting device according to another embodiment of the presentdisclosure;

FIG. 3 is a schematic sectional view schematically showing a lightemitting device according to still another embodiment of the presentdisclosure;

FIG. 4 is a top view schematically showing a light emitting deviceaccording to another embodiment of the present disclosure;

FIG. 5 is a flowchart illustrating a method for manufacturing a lightemitting device according to an embodiment of the present disclosure;

FIG. 6 is a schematic sectional view schematically showing a structureobtained at step S520 of a manufacturing process of the light emittingdevice in FIG. 5 according to an embodiment of the present disclosure.

It should be understood that the dimensions of the various parts shownin the accompanying drawings are not necessarily drawn according to theactual scale. In addition, the same or similar reference signs are usedto denote the same or similar components.

DETAILED DESCRIPTION

Various exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings. Thefollowing description of the exemplary embodiments is merelyillustrative and is in no way intended as a limitation to the presentdisclosure, its application or use. The present disclosure may beimplemented in many different forms, which are not limited to theembodiments described herein. These embodiments are provided to make thepresent disclosure thorough and complete, and fully convey the scope ofthe present disclosure to those skilled in the art. It should be noticedthat: relative arrangement of components and steps, materialcomposition, numerical expressions, and numerical values set forth inthese embodiments, unless specifically stated otherwise, should beexplained as merely illustrative, and not as a limitation.

The use of the terms “first”, “second” and similar words in the presentdisclosure do not denote any order, quantity or importance, but aremerely used to distinguish between different parts. A word such as“comprise”, “have” or variants thereof means that the element before theword covers the element(s) listed after the word without excluding thepossibility of also covering other elements. The terms “up”, “down”, orthe like are used only to represent a relative positional relationship,and the relative positional relationship may be changed correspondinglyif the absolute position of the described object changes.

In the present disclosure, when it is described that a specificcomponent is disposed between a first component and a second component,there may be an intervening component between the specific component andthe first component or between the specific component and the secondcomponent. When it is described that a specific part is connected toother parts, the specific part may be directly connected to the otherparts without an intervening part, or not directly connected to theother parts with an intervening part.

Unless otherwise defined, all terms (comprising technical and scientificterms) used herein have the same meanings as the meanings commonlyunderstood by one of ordinary skill in the art to which the presentdisclosure belongs. It should also be understood that terms as definedin general dictionaries, unless explicitly defined herein, should beinterpreted as having meanings that are consistent with their meaningsin the context of the relevant art, and not to be interpreted in anidealized or extremely formalized sense.

Techniques, methods, and apparatus known to those of ordinary skill inthe relevant art may not be discussed in detail, but where appropriate,these techniques, methods, and apparatuses should be considered as partof this specification.

The inventors of the present disclosure have found that a part of thelight each sub-pixel emits is emitted in a direction inclined to asurface of the sub-pixel, which causes a phenomenon of light mixingbetween adjacent sub-pixels of different colors, and results in poorcolor gamut and reduced visual effect.

In view of this, embodiments of the present disclosure provide a lightemitting device to alleviate a light mixing phenomenon between adjacentsub-pixels. A light emitting device according to some embodiments of thepresent disclosure will be described below in detail with reference tothe accompanying drawings. FIG. 1 is a schematic sectional viewschematically showing a light emitting device according to an embodimentof the present disclosure.

As shown in FIG. 1, the light emitting device may comprise a pixeldefine layer 2, a plurality of sub-pixels, and a blocking member 80. Theplurality of sub-pixels comprise a first sub-pixel 71 and a secondsub-pixel 72 adjacent to the first sub-pixel 71 and spaced apart fromthe first sub-pixel 71 by the pixel define layer 2. Each sub-pixel maycomprise a functional layer. The blocking member 80 may be disposed onthe pixel define layer 2. In addition, FIG. 1 also shows an anode(comprising a first anode 41 for a first sub-pixel and a second anode 42for a second sub-pixel), a via 5, and a spacer insulating layer 6between the anode and a backplane circuit (not shown in FIG. 1). The via5 is a via, in which a conductive material layer (for example, a metallayer) is disposed, formed through the spacer insulating layer 6. Theanode is conducted to the backplane circuit through the conductivematerial layer in the via 5. It should be noted that although the anodeand the conductive material layer in the via 5 shown in FIG. 1 areintegrally formed, the scope of the embodiments of the presentdisclosure is not limited thereto. The anode and the conductive materiallayer in the via may be separately formed. For example, the anode andthe conductive material layer in the via can be structures of differentmaterials.

In the light emitting device of this embodiment, a blocking member isdisposed on the pixel define layer. The blocking member can block lightsemitted by the first sub-pixel and the second sub-pixel, respectively,from emitting and mixing above the pixel define layer as much aspossible. In this way, the light mixing phenomenon between adjacentfirst sub-pixel and second sub-pixel can be alleviated, and the displayeffect of the light emitting device is improved.

In some embodiments, as shown in FIG. 1, a slope angle θ formed by theblocking member 80 on the pixel define layer may range from 1°<θ<60°.For example, the slope angle θ may be 10°, 20°, 30°, or 50°. Here, theslope angle may be an angle between a slope of the blocking member andan upper surface of the pixel define layer. In this embodiment, theabove slope angle can be set to be in appropriate range to alleviate thelight mixing phenomenon between adjacent sub-pixels as much as possibleand prevent light normally emitted by the sub-pixels from blocking asmuch as possible. It should be noted that the range of the slope angle θof the embodiments of the present disclosure is not limited thereto andthe slope angle θ can be set to other angles as needed by those skilledin the art.

In some embodiments, the blocking member 80 may comprise an insulatinglayer. For example, the insulating layer may comprise at least one ofsilicon dioxide or silicon nitride. In this embodiment, an embodiment inwhich an insulating layer is used as a blocking member on the pixeldefine layer is described. However, implementations of the embodimentsof the present disclosure are not limited thereto. Embodiments of thepresent disclosure may also comprise an embodiment in which a blockingmember is formed with a structural layer of the same material as that ofthe functional layer of the sub-pixel.

In some embodiments, the blocking member may comprise a first componentand a second component. A material of the first component is the same asthat of at least a part of the functional layer of the first sub-pixel.A material of the second component is the same as that of at least apart of the functional layer of the second sub-pixel. The firstcomponent and the second component are stacked on the pixel definelayer. In this embodiment, a structural layer of the same material asthat of at least a part of the functional layers of adjacent twosub-pixels is utilized as a blocking member. No other material layerneeds to be introduced during the manufacturing process, which makes themanufacturing process easier to implement.

In some embodiments, the first component of the blocking member may be apart of the functional layer of the first sub-pixel extending above thepixel define layer, and the second component of the blocking member maybe a part of the functional layer of the second sub-pixel extendingabove the pixel define layer. For example, a functional layer of eachsub-pixel may extend above the pixel define layer. The adjacent firstsub-pixel and second sub-pixel each has a part of functional layeroverlapping on the pixel define layer to form an overlapping part. Thisoverlapping part can serve as a blocking member. Of course, the scope ofthe embodiments of the present disclosure is not limited to theextending situation described herein. For example, during themanufacturing process, the functional layers of the overlapping part maybe spaced apart from the functional layers of the respective sub-pixels,respectively.

In some embodiments, the functional layer may comprise a light emittinglayer. For example, the first component of the blocking member maycomprise a part of the same material as that of the light emitting layerof the first sub-pixel, and the second component of the blocking membermay comprise a part of the same material as that of the light emittinglayer of the second sub-pixel.

In other embodiments, the functional layer further comprises a firstcarrier transport layer and a second carrier transport layer. The lightemitting layer is located between the first carrier transport layer andthe second carrier transport layer. The first component and the secondcomponent of the blocking member each comprises a part of a samematerial as that of the first carrier transport layer, and the part ofthe same material as that of the first carrier transport layer of thefirst component is spaced apart from the part of the same material asthat of the first carrier transport layer of the second component.

For example, the first carrier transport layer comprises an ElectronTransport Layer (ETL), and the second carrier transport layer comprisesa Hole Transport Layer (HTL). For another example, the first carriertransport layer comprises the hole transport layer, and the secondcarrier transport layer comprises the electron transport layer. Forexample, the electron transport layer, the hole transport layer, and thelight emitting layer may each be an organic layer. It should be notedthat the functional layer may further comprise other organic layers orinorganic layers other than at least one of the electron transportlayer, the hole transport layer, or the light emitting layer. Forexample, the functional layer may comprise an electron blocking layer ora hole blocking layer or the like. Therefore, the scope of theembodiments of the present disclosure is not limited to the examples ofthe functional layers described herein.

In some embodiments, the first component of the blocking member maycomprise a part of a same material as that of at least one of theelectron transport layer, the hole transport layer, or the lightemitting layer of the first sub-pixel. The second component of theblocking member may comprise a part of a same material as that of atleast one of the electron transport layer, the hole transport layer, orthe light emitting layer of the second sub-pixel. For example, at leastone of the electron transport layer, the hole transport layer, or thelight emitting layer of the first sub-pixel may extend onto the pixeldefine layer, and at least one of the electron transport layer, the holetransport layer, or the light emitting layer of the second sub-pixel mayalso extend onto the pixel define layer. The two extended parts overlapon the pixel define layer to form an overlapping part. This overlappingpart can serve as a blocking member. Of course, the scope of theembodiments of the present disclosure is not limited to the extendingsituation described herein. For example, in the manufacturing process,the overlapping part may be spaced apart from the correspondingsub-pixels, respectively.

In a case where the first component and the second component of theblocking member each comprises a part of a same material as that of theelectron transport layer, the part of the same material as that of theelectron transport layer of the first component is spaced apart from thepart of the same material as that of the electron transport layer of thesecond component. For example, in a case where the first componentcomprises a part of the same material as that of the electron transportlayer of the first sub-pixel and the second component comprises a partof the same material as that of the electron transport layer of thesecond sub-pixel, the part of the same material as that of the electrontransport layer of the first sub-pixel of the first component is spacedapart from the part of the same material as that of the electrontransport layer of the second sub-pixel of the second component. In thisembodiment, in a direction perpendicular to a surface of the pixeldefine layer adjacent to the blocking member, the part of the samematerial as that of the electron transport layer of the first componentmay be spaced apart from the part of the same material as that of theelectron transport layer of the second component by different structurallayers, so that the electrons between different sub-pixels do not affecteach other, and the accuracy of emission of sub-pixel is improved.

In a case where the first component and the second component of theblocking member each comprises a part of a same material as that of thehole transport layer, the part of the same material as that of the holetransport layer of the first component is spaced apart from the part ofthe same material as that of the hole transport layer of the secondcomponent. For example, in a case where the first component comprises apart of the same material as that of the hole transport layer of thefirst sub-pixel and the second component comprises a part of the samematerial as that of the hole transport layer of the second sub-pixel,the part of the same material as that of the hole transport layer of thefirst sub-pixel of the first component is spaced apart from the part ofthe same material as that of the hole transport layer of the secondsub-pixel of the second component. In this embodiment, in a directionperpendicular to a surface of the pixel define layer adjacent to theblocking member, the part of the same material as that of the holetransport layer of the first component may be spaced apart from the partof the same material as that of the hole transport layer of the secondcomponent by different structural layers, so that holes betweendifferent sub-pixels do not affect each other, and the accuracy ofemission of sub-pixel is improved.

Embodiments in which the overlapping part of the functional layers isused as a blocking member will be described below in detail withreference to FIGS. 2 and 3, respectively.

FIG. 2 is a schematic sectional view schematically showing a lightemitting device according to another embodiment of the presentdisclosure. As shown in FIG. 2, the light emitting device may comprise apixel define layer 2, a plurality of sub-pixels, and a blocking member80′. The plurality of sub-pixels comprise a first sub-pixel 71 and asecond sub-pixel 72 spaced apart from the first sub-pixel 71 by thepixel define layer 2. Each sub-pixel may comprise a functional layer.The blocking member 80′ may be disposed on the pixel define layer 2.

For example, as shown in FIG. 2, the functional layer of the firstsub-pixel 71 may comprise an electron transport layer (which may bereferred to as a first electron transport layer) 311, a hole transportlayer (which may be referred to as a first hole transport layer) 313,and a light emitting layer (which may be referred to as a first lightemitting layer) 312 between the electron transport layer 311 and thehole transport layer 313. The functional layer of the second sub-pixel72 may comprise an electron transport layer (which may be referred to asa second electron transport layer) 321, a hole transport layer (whichmay be referred to as a second hole transport layer) 323, and a lightemitting layer (which may be referred to as a second light emittinglayer) 322 between the electron transport layer 321 and the holetransport layer 323.

In some embodiments, as shown in FIG. 2, a first component of theblocking member 80′ can comprise a part of a same material as that ofthe light emitting layer 312 of the first sub-pixel 71. In someembodiments, as shown in FIG. 2, a second component of the blockingmember 80′ can comprise a part of a same material as that of the lightemitting layer 322 of the second sub-pixel 72.

For example, as shown in FIG. 2, the first light emitting layer 312 andthe second light emitting layer 322 may each extend onto the pixeldefine layer 2, respectively. Moreover, the extended parts of the twolight emitting layers overlap on the pixel define layer to form anoverlapping part. This overlapping part can serve as a blocking member80′. In the blocking member 80′, an extended part of the second lightemitting layer 322 covers an extended part of the first light emittinglayer 312. The effect of blocking light emitted by adjacent twosub-pixels that causes a mixing phenomenon can be achieved by theblocking member, and the light mixing phenomenon of the two sub-pixelscan be alleviated.

In some embodiments, as shown in FIG. 2, the slope angle θ formed by theoverlapping part of the blocking member 80′ on the pixel define layermay range from 1°<θ<60°. In this embodiment, when two light emittinglayer overlap, the light emitting layer at an upper position appears toclimb on the light emitting layer at a lower position, thus a slopeangle is formed. In the range of the slope angle described above, thefunctional layer (for example, an organic layer) and a cathode layer(described later) on the functional layer are not easily broken at thebottom corner, so that electrical properties of the light emittingdevice are not affected.

In some embodiments, as shown in FIG. 2, in a case where the secondcomponent (e.g., an extended part of the second light emitting layer322) of the blocking member covers the first component (e.g., anextended part of the first light emitting layer 312) of the blockingmember, the first sub-pixel 71 may be a red sub-pixel, and the secondsub-pixel 72 may be a green sub-pixel or a blue sub-pixel. In otherembodiments, in a case where the second component of the blocking membercovers the first component of the blocking member, the first sub-pixel71 may be a green sub-pixel and the second sub-pixel 72 can be a bluesub-pixel. Here, the red sub-pixel is a sub-pixel that can emit redlight, the green sub-pixel is a sub-pixel that can emit green light, andthe blue sub-pixel is a sub-pixel that can emit blue light.

In the above embodiment, at the overlapping part serving as a blockingmember, the part of the same material as that of the light emittinglayer of the green sub-pixel or the blue sub-pixel covers the part ofthe same material as that of the light emitting layer of the redsub-pixel. Alternatively, at the overlapping part, the part of the samematerial as that of the light emitting layer of the blue sub-pixelcovers the part of the same material as that of the light emitting layerof the green sub-pixel. In such an overlapping coverage manner,thicknesses of organic layers (for example, light-emitting layers) ofRGB (R represents a red sub-pixel, G represents a green sub-pixel, and Brepresents a blue sub-pixel) can be set to decrease gradually in themanufacturing process, so that the subsequent evaporation process has atime shorter than that of the previous evaporation process, and has lesseffect on the organic layer formed in the previous evaporation process.

For example, a light emitting layer of a red sub-pixel is formed first,and then a light emitting layer of a blue or green sub-pixel is formed.Since the light emitting layer of the blue or green sub-pixel is thinnerthan the light-emitting layer of the red sub-pixel, the time of theevaporation process required to form the light emitting layer of theblue or green sub-pixel is shorter, and the effect on the light emittinglayer of the red sub-pixel that has been formed is less.

In addition, the human eye is insensitive to a blue sub-pixel. Thus, ina case where the blue light emitting layer is located at the uppermostposition, blue fluorescence (even if generated) will has less effect onthe visual effect of the image viewed by the human eye.

In some embodiments of the present disclosure, as shown in FIG. 2, thelight emitting device may further comprise a cathode layer 1. Forexample, the cathode layer 1 may cover an entire area (which may bereferred to as an active area) of a plurality of sub-pixels. The cathodelayer 1 is located above the electron transport layer.

In some embodiments of the present disclosure, the light emitting devicemay further comprise a drive transistor (e.g., a TFT (Thin FilmTransistor)). For example, as shown in FIG. 2, the drive transistor maycomprise a semiconductor layer 92, a gate insulating layer 93, a gateelectrode 94, a source electrode 95, and a drain electrode 96, or thelike. The semiconductor layer 92 is on the substrate 91. For example, abuffer layer (not shown) may be disposed between the substrate 91 andthe semiconductor layer 92. The gate insulating layer 93 is locatedbetween the gate electrode 94 and the semiconductor layer 92. The sourceelectrode 95 is connected to the anode 42 (or 41) through a conductivematerial layer in the via 5 and to the semiconductor layer 92 through aconductive material layer in another via 971. The drain electrode 96 isconnected to the semiconductor layer 92 through a conductive materiallayer in another via 972. In addition, the light emitting device mayfurther comprise other insulating layers (for example, insulating layers981 and 982) or a planarization layer, or the like.

In embodiments of the present disclosure, the sub-pixel may comprise anorganic light emitting diode. The light emitting devices according tosome embodiments of the present disclosure will be described below indetail from another perspective.

Embodiments of the present disclosure further provide a light emittingdevice. For example, as shown in FIG. 2, the light emitting device maycomprise a plurality of drive transistors, a substrate 91, a pluralityof organic light emitting diodes, and a blocking member 80′.

Each of the drive transistors may comprise a first electrode. Forexample, the first electrode can be a source electrode 95. The substrate91 is located on one side of the plurality of drive transistors. Theplurality of organic light emitting diodes are located on the other sideof the plurality of drive transistors opposite to the substrate 91. Eachof the organic light emitting diodes may comprise a second electrode(e.g., anode 41 or 42), a third electrode (e.g., cathode 1), and afunctional layer. The second electrode is electrically connected to thefirst electrode (for example, the anode 41 or 42 is electricallyconnected to the source electrode 95). At least a part of the functionallayer is located between the second electrode and the third electrode.The plurality of organic light emitting diodes comprise at least a firstorganic light emitting diode 701 and a second organic light emittingdiode 702 adjacent to the first organic light emitting diode 701 andspaced apart from the first organic light emitting diode 701 by thepixel define layer 2. The functional layer may comprise at least a lightemitting layer 312 or 322. An area of a surface of the light emittinglayer away from the substrate is greater than that of a surface of thesecond electrode (e.g., anode 41 or 42) away from the substrate. Thisallows the light emitting layer to be in full contact with otherfunctional layers such as an electron transport layer or a holetransport layer, ensuring an effective light emitting area as much aspossible.

The blocking member 80′ is located on a side of the pixel define layer 2away from the substrate. A projection of the blocking member 80′ on thesubstrate 91 is spaced apart from a projection of the second electrode(e.g., the anode 41 or 42) on the substrate 91. The blocking member 80′may comprise a part of a same material as that of the functional layer(e.g., a light emitting layer). For example, the blocking member 80′ maycomprise a part formed by the light emitting layers 312 and 322extending onto the pixel define layer 2 and overlapping.

In some embodiments, as shown in FIG. 2, the drive transistor can alsocomprise a gate electrode 94, a drain electrode 96, and a semiconductorlayer 92. The semiconductor layer 92 is located on the substrate 91. Thegate electrode 94 and the semiconductor layer 92 are spaced apart by thegate insulating layer 93. The source electrode 95 is connected to thesecond electrode (e.g., anode 42 or 41). The source electrode 95 and thedrain electrode 96 are connected to the semiconductor layer 92,respectively. A projection of the semiconductor layer 92 on thesubstrate 91 is within a projection of the second electrode (e.g., anode42 or 41) on the substrate 91.

In some embodiments, as shown in FIG. 2, the functional layer mayfurther comprise a hole transport layer 313 (or 323) and an electrontransport layer 311 (or 321).

In some embodiments, the blocking member 80′ may comprise a firstcomponent and a second component. A material of the first component isthe same as that of at least a part of the functional layer of the firstorganic light emitting diode 701. A material of the second component isthe same as that of at least a part of the functional layer of thesecond organic light emitting diode 702. For example, as shown in FIG.2, the material of the first component of the blocking member 80′ is thesame as that of the light emitting layer 312 of the first organic lightemitting diode 701, and the material of the second component of theblocking member 80′ is the same as that of the light emitting layer 322of the second organic light emitting diode 702. The first component andthe second component are stacked on the pixel define layer.

In some embodiments, the first component may be a part of the functionallayer of the first organic light emitting diode extending above thepixel define layer, and the second component may be a part of thefunctional layer of the second organic light emitting diode extendingabove the pixel define layer. For example, as shown in FIG. 2, the firstcomponent may be a part of the light emitting layer 312 of the firstorganic light emitting diode 701 extending above the pixel define layer2, and the second component may be a part of the light emitting layer322 of the second organic light emitting diode 702 extending above thepixel define layer 2.

In some embodiments, in a case where the second component covers thefirst component, the first organic light emitting diode 701 may be a redorganic light emitting diode, and the second organic light emittingdiode 702 may be a green organic light emitting diode or a blue organiclight emitting diode. In other embodiments, in a case where the secondcomponent covers the first component, the first organic light emittingdiode 701 may be a green organic light emitting diode, and the secondorganic light emitting diode 702 may be a blue organic light emittingdiode.

FIG. 3 is a schematic sectional view schematically showing a lightemitting device according to another embodiment of the presentdisclosure. As shown in FIG. 3, the light emitting device may comprise apixel define layer 2, a plurality of sub-pixels, and a blocking member80″. The plurality of sub-pixels comprise a first sub-pixel 71 and asecond sub-pixel 72 spaced apart from the first sub-pixel 71 by thepixel define layer 2. Each sub-pixel may comprise a functional layer.The blocking member 80″ may be disposed on the pixel define layer 2.Here, the same/similar structure(s) of the light emitting device shownin FIG. 3 as/to that of the light emitting device shown in FIG. 2 willnot be described.

In some embodiments, as shown in FIG. 3, a first component of theblocking member 80″ may comprise three parts of a same material as thatof the first carrier transport layer (for example, the electrontransport layer 311), the second carrier transport layer (for example,the hole transport layer 313), and the light emitting layer 312 of thefirst sub-pixel 71, respectively. In some embodiments, as shown in FIG.3, a second component of the blocking member 80″ may comprise threeparts of a same material as that of the first carrier transport layer(for example, the electron transport layer 321), the second carriertransport layer (for example, the hole transport layer 323), and thelight emitting layer 322 of the second sub-pixel 72, respectively.

For example, as shown in FIG. 3, the electron transport layer 311, thehole transport layer 313, and the light emitting layer 312 of the firstsub-pixel 71 may extend entirely onto the pixel define layer 2. Theelectron transport layer 321, the hole transport layer 323, and thelight emitting layer 322 of the second sub-pixel 72 may also extendentirely onto the pixel define layer 2. The extended part of theabove-described respective layers of the first sub-pixel 71 and theextended part of the above-described respective layers of the secondsub-pixel 72 overlap above the pixel define layer 2 to form anoverlapping part. This overlapping part can serve as a blocking member80″. The effect of blocking light emitted by adjacent two sub-pixelsthat causes a mixing phenomenon can be achieved by the blocking member,and the light mixing phenomenon of the two sub-pixels can be alleviated.

In the blocking member 80″, the extended part of the respective layersof the second sub-pixel 72 (comprising the electron transport layer 321,the hole transport layer 323, and the light emitting layer 322) entirelycovers the extended part of the respective layers of the first sub-pixel71 (comprising the electron transport layer 311, the hole transportlayer 313, and the light emitting layer 312). For example, as shown inFIG. 3, in a structural layer of the overlapping part, in a directionperpendicular to an upper surface of the pixel define layer (i.e., thesurface adjacent to the blocking member), the two electron transportlayers 311 and 312 are spaced apart by the light emitting layer 322 andthe hole transport layers 323, and the two hole transport layers 313 and323 are spaced apart by the electron transport layer 311 and the lightemitting layer 312, so that carriers between different sub-pixels do notaffect each other. It should be noted that although a side surface ofthe hole transport layer 313 may be in contact with the hole transportlayer 323, but the contact area is small and the contact resistance islarge, thus holes are difficult to be transmitted between the two holetransport layers and the light emission of different sub-pixels is notsubstantially affected.

Compared to the structure of the light emitting device shown in FIG. 2,all the functional layers in the light emitting device shown in FIG. 3overlap between adjacent sub-pixels, which can increase a thickness ofthe overlapping part, that is, the blocking member, thus the effect ofblocking light mixing is improved.

In some embodiments, as shown in FIG. 3, a slope angle θ formed by theoverlapping part as the blocking member 80″ on the pixel define layermay range from 1°<θ<60°.

In some embodiments, similar to the previous description, as shown inFIG. 3, in a case where the second component of the blocking membercovers the first component of the blocking member, the first sub-pixel71 may be a red sub-pixel, and the second sub-pixel 72 can be a greensub-pixel or a blue sub-pixel. In other embodiments, similar to theprevious description, as shown in FIG. 3, in a case where the secondcomponent of the blocking member covers the first component of theblocking member, the first sub-pixel 71 may be a green sub-pixel, andthe second sub-pixel 72 can be a blue sub-pixel. Such a design has arelatively small effect on the images viewed by the human eye.

It should be noted that FIG. 2 shows an embodiment in which lightemitting layers of two sub-pixels overlap on a pixel define layer toform a blocking member, and FIG. 3 shows an embodiment in which theelectron transport layers, the hole transport layers and the lightemitting layers of two sub-pixels overlap on the pixel define layer toform a blocking member. It should be understood that the blocking memberof the embodiments of the present disclosure is not limited to thestructure mentioned in the above embodiments. For example, the blockingmember may comprise a structure formed with the electron transport layer311 and the hole transport layer 323 overlapping on the pixel definelayer. For another example, the blocking member may comprise a structureformed with two light emitting layers 312 and 322, the electrontransport layer 311 and the hole transport layer 323 overlapping on thepixel define layer. For another example, the blocking member maycomprise a structure formed with two light emitting layers 312 and 322,the electron transport layer 321 and the hole transport layer 313overlapping on the pixel define layer. Of course, it should beunderstood by those skilled in the art that the blocking member can alsobe a structure formed with the functional layers overlapping by otherways, which are not enumerated here.

In some embodiments, as shown in FIG. 3, an area of a surface of thehole transport layer 313 or 323 away from the drive transistor isgreater than that of a surface of the second electrode (e.g., anode 41or 42) of the organic light emitting diode 701 or 702 away from thedrive transistor. In some embodiments, as shown in FIG. 3, an area of asurface of the electron transport layer 311 or 321 away from the drivetransistor is greater than that of a surface of the second electrode(e.g., anode 41 or 42) of the organic light emitting diode 701 or 702away from the drive transistor.

In some embodiments, in a case where the first sub-pixel 71 is a redsub-pixel, and the second sub-pixel 72 is a green sub-pixel (or thefirst organic light emitting diode 701 is a red organic light emittingdiode, and the second organic light emitting diode 702 is a greenorganic light emitting diode), the blocking member (for example, theoverlapping part shown in FIG. 2 or FIG. 3) may have a thickness rangingfrom 500 Å to 3500 Å. For example, the blocking member may have athickness of 1000 Å, 2000 Å, or 3000 Å.

In other embodiments, in a case where the first sub-pixel 71 is a greensub-pixel, and the second sub-pixel 72 is a blue sub-pixel (or the firstorganic light emitting diode 701 is a green organic light emittingdiode, and the second organic light emitting diode 702 is a blue organiclight emitting diode), the blocking member (for example, the overlappingpart shown in FIG. 2 or FIG. 3) may have a thickness ranging from 400 Åto 2700 Å. For example, the blocking member may have a thickness of 700Å, 1000 Å, or 2000 Å.

In other embodiments, in a case where the first sub-pixel 71 is a redsub-pixel, and the second sub-pixel 72 is a blue sub-pixel (or the firstorganic light emitting diode 701 is a red organic light emitting diode,and the second organic light emitting diode 702 is a blue organic lightemitting diode), the blocking member (for example, the overlapping partshown in FIG. 2 or FIG. 3) may have a thickness ranging from 400 Å to2700 Å. For example, the blocking member may have a thickness of 700 Å,1000 Å, or 2000 Å.

FIG. 4 is a top view schematically showing a light emitting deviceaccording to another embodiment of the present disclosure.

As shown in FIG. 4, a first region 301 is a region of a functional layerof a red sub-pixel R and an extended part of the functional layer of thered sub-pixel R, a second region 302 is a region of a functional layerof a green sub-pixel G and an extended part of the functional layer ofthe green sub-pixel G, and the third region 303 is a region of afunctional layer of a blue sub-pixel B and an extended part of thefunctional layer of the blue sub-pixel B. There are overlapping regionsbetween adjacent sub-pixels in these sub-pixels.

In some embodiments, as shown in FIG. 4, in a plurality of sub-pixels,an area of the third region 303 is greater than that of the first region301, and an area of the first region 301 is greater than that of thesecond region 302. Such a design can achieve better effect of imagesviewed by the human eye.

In some embodiments, one pixel may be composed of sub-pixels of threecolors, namely, red sub-pixel, green sub-pixel and blue sub-pixel. Onepixel may be composed of one red sub-pixel, one blue sub-pixel and twogreen sub-pixels. Moreover, one green sub-pixel can be common to twopixels.

In some embodiments, as shown in FIG. 4, in a plurality of sub-pixels,sub-pixels of the same row are alternately arranged in RGBG. Such anarrangement may substantially result in overlapping regions between anytwo adjacent sub-pixels of different colors.

In some embodiments, as shown in FIG. 4, in two adjacent columns ofsub-pixels, the green sub-pixels G are arranged in one column ofsub-pixels, and the red sub-pixels R and the blue sub-pixels B arealternately arranged in the other column of sub-pixels. Such a designcan make the green sub-pixels G be reused in different pixels. Forexample, the green sub-pixels G of the first row of pixels may serve assub-pixels of the first row of pixels when a first frame is displayed,and may also serve as sub-pixels of the second row of pixels when asecond frame is displayed as frame needed. This will make the displayedimage has more rounded corners and higher resolution.

Embodiments of the present disclosure also provide a display devicecomprising the light emitting device as described above, for example,the light emitting device as shown in FIG. 1, FIG. 2 or FIG. 3. Forexample, the display device may comprise a display panel, a displayscreen, a mobile phone, a tablet, a notebook computer, or the like.

FIG. 5 is a flowchart illustrating a method for manufacturing a lightemitting device according to an embodiment of the present disclosure.

At step S520, a pixel define layer is formed on an initial substratestructure. The pixel define layer is formed with a plurality of openingsexposing the initial substrate structure.

FIG. 6 is a schematic sectional view schematically showing a structureobtained at step S520 of a manufacturing process of the light emittingdevice in FIG. 5 according to an embodiment of the present disclosure.As shown in FIG. 6, a pixel define layer 2 is formed on an initialsubstrate structure 100. For example, as shown in FIG. 6, the initialsubstrate structure 100 may comprise an anode (e.g., a first anode 41and a second anode 42), a spacer insulating layer 6, a via 5 connectedto the anode, or the like. Of course, it can be understood by thoseskilled in the art that the initial substrate structure 100 can alsocomprise other structural layers, which are not shown here.

As shown in FIG. 6, the pixel define layer 2 is formed with a pluralityof openings 201 exposing the initial substrate structure 100. Forexample, the pixel define layer 2 can be etched to form the plurality ofopenings 201. For example, each opening 201 can expose an anode. Forexample, as shown in FIG. 6, for two adjacent openings, one openingexposes the first anode 41 and the other opening exposes the secondanode 42.

Back to FIG. 5, at step S540, functional layers for a plurality ofsub-pixels are formed in the plurality of openings, and a blockingmember is formed on the pixel define layer.

FIG. 6 is a schematic sectional view schematically showing a structureobtained at step S540 of a manufacturing process of the light emittingdevice in FIG. 5 according to an embodiment of the present disclosure.As shown in FIG. 1, a functional layer of the first sub-pixel 71 isformed in one of the plurality of openings, a functional layer of thesecond sub-pixel 72 is formed in another adjacent one of the pluralityof openings, and a blocking member 80 is formed on the pixel definelayer 2.

In some embodiments, a material of the blocking member is different fromthat of the sub-pixel. For example, the blocking member may comprise aninsulating layer, and the sub-pixel may comprise a functional layer(e.g., an organic layer). In such a case, a functional layer and ablocking member of a sub-pixel can be formed separately. For example,functional layers for a plurality of sub-pixels may be formed in aplurality of openings first, and then a blocking member may be formed onthe pixel define layer. For another example, a blocking member may beformed on the pixel define layer first and then functional layers for aplurality of sub-pixels may be formed in a plurality of openings.

In other embodiments, a material of the blocking member may be the sameas that of at least a part of the functional layers of the plurality ofsub-pixels. In such a case, a blocking member may be formed in theprocess of forming functional layers of the plurality of sub-pixels. Forexample, a part of the functional layers may also be formed on the pixeldefine layer in the process of forming a part of the functional layersof the first sub-pixel and the second sub-pixel. A blocking member canbe formed with these functional layers overlapping on the pixel definelayer.

In some embodiments, a functional layer of the sub-pixel may comprise anelectron transport layer, a hole transport layer, and a light-emittinglayer. For example, in the process of forming the light emitting layerof the first sub-pixel and a light emitting layer of the secondsub-pixel, a part of a light emitting layer of the first sub-pixel canbe overlaid on the pixel define layer by an evaporation or printingprocess, and then a part of the light emitting layer of the secondsub-pixel can be overlaid on the part of the light-emitting layer of thefirst sub-pixel located on the pixel define layer (refer to FIG. 2) byan evaporation or printing process. Thus, a blocking member is formedwith light emitting layers of adjacent sub-pixels overlapping on thepixel define layer.

Heretofore, a method of manufacturing a light emitting device accordingto some embodiments of the present disclosure has been provided. In themanufacturing method, a blocking member is formed on the pixel definelayer. The blocking member can block light emitted by the firstsub-pixel and the second sub-pixel from being respectively above thepixel define layer to cause a light mixing phenomenon as much aspossible. Thereby, the light mixing phenomenon between adjacent firstsub-pixel and second sub-pixel can be alleviated, and the display effectof the light emitting device can be improved.

Hereto, various embodiments of the present disclosure have beendescribed in detail. Some details well known in the art are notdescribed to avoid obscuring the concept of the present disclosure.According to the above description, those skilled in the art would fullyknow how to implement the technical solutions disclosed herein.

Although some specific embodiments of the present disclosure have beendescribed in detail by way of examples, those skilled in the art shouldunderstand that the above examples are only for the purpose ofillustration and are not intended to limit the scope of the presentdisclosure. It should be understood by those skilled in the art thatmodifications to the above embodiments and equivalently substitution ofpart of the technical features can be made without departing from thescope and spirit of the present disclosure. The scope of the disclosureis defined by the following claims.

What is claimed is:
 1. A light emitting device, comprising: a pixeldefine layer; a plurality of sub-pixels, comprising a first sub-pixel,and a second sub-pixel adjacent to and spaced apart from the firstsub-pixel by the pixel define layer, wherein each of the plurality ofsub-pixels comprises a functional layer, and the functional layercomprises a light emitting layer, a first carrier transport layer, and asecond carrier transport layer, wherein the light emitting layer islocated between the first carrier transport layer and the second carriertransport layer; and a blocking member disposed on the pixel definelayer, wherein the blocking member comprises a first component and asecond component stacked on the pixel define layer, wherein a materialof the first component is the same as that of at least a part of thefunctional layer of the first sub-pixel, and a material of the secondcomponent is the same as that of at least a part of the functional layerof the second sub-pixel, the first component and the second componenteach comprises a part of a same material as that of the first carriertransport layer, and the part of the same material as that of the firstcarrier transport layer of the first component is spaced apart from thepart of the same material as that of the first carrier transport layerof the second component.
 2. The light emitting device according to claim1, wherein: the first component comprises three parts of a same materialas that of the first carrier transport layer, the second carriertransport layer, and the light emitting layer of the first sub-pixel,respectively; the second component comprises three parts of a samematerial as that of the first carrier transport layer, the secondcarrier transport layer, and the light emitting layer of the secondsub-pixel, respectively.
 3. The light emitting device according to claim1, wherein a slope angle θ formed by the blocking member on the pixeldefine layer ranges from 1°<0<60°.
 4. The light emitting deviceaccording to claim 1, wherein the first component is a part of thefunctional layer of the first sub-pixel extending above the pixel definelayer, and the second component is a part of the functional layer of thesecond sub-pixel extending above the pixel define layer.
 5. The lightemitting device according to claim 4, wherein in a case where the secondcomponent covers the first component: the first sub-pixel is a redsub-pixel, and the second sub-pixel is a green sub-pixel or a bluesub-pixel; or the first sub-pixel is a green sub-pixel, and the secondsub-pixel is a blue sub-pixel.
 6. The light emitting device according toclaim 5, wherein in the plurality of sub-pixels: a sum of areas of thefunctional layer of the blue sub-pixel and the part of the functionallayer of the blue sub-pixel extending above the pixel define layer isgreater than that of the functional layer of the red sub-pixel and thepart of the functional layer of the red sub-pixel extending above thepixel define layer in a case where the first sub-pixel is the redsub-pixel and the second sub-pixel is the blue sub-pixel, and a sum ofareas of the functional layer of the red sub-pixel and the part of thefunctional layer of the red sub-pixel extending above the pixel definelayer is greater than that of the functional layer of the greensub-pixel and the part of the functional layer of the green sub-pixelextending above the pixel define layer in a case where the firstsub-pixel is the red sub-pixel and the second sub-pixel is the greensub-pixel.
 7. A display device, comprising the light emitting deviceaccording to claim
 1. 8. A light emitting device, comprising: aplurality of drive transistors, each of the plurality of drivetransistors comprising a first electrode; a substrate located on oneside of the plurality of drive transistors; a plurality of organic lightemitting diodes located on the other side of the plurality of drivetransistors opposite to the substrate, comprising at least a firstorganic light emitting diode and a second organic light emitting diodeadjacent to and spaced apart from the first organic light emitting diodeby a pixel define layer, wherein: each of the plurality of organic lightemitting diodes comprises a second electrode electrically connected tothe first electrode, a third electrode, and a functional layer at leasta part of which being located between the second electrode and the thirdelectrode, and the functional layer comprises a light emitting layer, afirst carrier transport layer, and a second carrier transport layer,wherein the light emitting layer is located between the first carriertransport layer and the second carrier transport layer, an area of asurface of the light emitting layer of the first organic light emittingdiode away from the substrate is greater than that of a surface of thesecond electrode of the first organic light emitting diode away from thesubstrate and an area of a surface of the light emitting layer of thesecond organic light emitting diode away from the substrate is greaterthan that of a surface of the second electrode of the second organiclight emitting diode away from the substrate; and a blocking memberlocated on a side of the pixel define layer away from the substrate,wherein a projection of the blocking member on the substrate is spacedapart from a projection of the second electrode on the substrate, andthe blocking member comprises a part of a same material as that of thefunctional layer, wherein the blocking member comprises a firstcomponent and a second component stacked on the pixel define layer,wherein a material of the first component is the same as that of atleast a part of the functional layer of the first organic light emittingdiode, and a material of the second component is the same as that of atleast a part of the functional layer of the second organic lightemitting diode, the first component and the second component eachcomprises a part of a same material as that of the first carriertransport layer, and the part of the same material as that of the firstcarrier transport layer of the first component is spaced apart from thepart of the same material as that of the first carrier transport layerof the second component.
 9. The light emitting device according to claim8, wherein: the first electrode is a source electrode; each of theplurality of drive transistors further comprises a gate electrode, adrain electrode, and a semiconductor layer, wherein a projection of thesemiconductor layer on the substrate is located within a projection ofthe second electrode on the substrate.
 10. The light emitting deviceaccording to claim 8, wherein the first carrier transport layercomprises a hole transport layer and the second carrier transport layercomprises an electron transport layer, wherein an area of a surface ofthe hole transport layer away from the substrate and an area of asurface of the electron transport layer away from the substrate each isgreater than that of a surface of the second electrode away from thesubstrate.
 11. The light emitting device according to claim 8, wherein aslope angle θ formed by the blocking member on the pixel define layerranges from 1°<0<60°.
 12. The light emitting device according to claim8, wherein the first component is a part of the functional layer of thefirst organic light emitting diode extending above the pixel definelayer, and the second component is a part of the functional layer of thesecond organic light emitting diode extending above the pixel definelayer.
 13. The light emitting device according to claim 8, wherein in acase where the second component covers the first component: the firstorganic light emitting diode is a red organic light emitting diode, andthe second organic light emitting diode is a green organic lightemitting diode or a blue organic light emitting diode; or the firstorganic light emitting diode is a green organic light emitting diode,and the second organic light emitting diode is a blue organic lightemitting diode.